CoolD2C T

Product introduction

CoolD2C T 2-phase in-rack liquid-cooling units (Direct-to-Chip) provide up to 100 kW of cooling capacity and reliably manage heat dissipation for the most demanding computing devices — GPUs and CPUs — with high thermal power density.
Hot-swappable components in a familiar in-rack form factor deliver unmatched reliability and easy field serviceability. Two-phase, direct-to-chip cooling is built for next-generation processors. It’s validated to 4,5 kW per socket and removes typical heat fluxes of 0,25 kW/cm2 and hot-spot fluxes above 0,5 kW/cm2. A non-conductive dielectric fluid protects electronics so components remain safe.

Key benefits of the product

• Cooling capacity: up to 100 kW
• Up to 4,5 kW per socket and hot-spot fluxes above 0,5 kW/cm2
• Thermal uniformity eliminates hot spots
• Industrial condenser with an isolated facility water loop accepts warm (ASHRAE W45) or chilled water. Design prevents water contact with electronics, eliminating water-related risk to GPUs and CPUs.
• Multiple redundancies with hot-swappable servicing ensure continuous operation and fast field replacement
• 7" touchscreen provides local monitoring and control of the CoolD2C T system
• Multilayer nylon AC hosing runs from servers to manifolds for robust fluid delivery
• Most field repairs and maintenance can be completed without an HVAC technician
• Standard data-center compatibility enables fast installation and minimal training